X-ray for food
Nikon
XT V 130C
Compact microfocus X-ray for PCB, BGA, connectors and small electronic components.
130 kVManual inspection
ELECTRONICS X-RAY INSPECTION
Find hidden defects before they reach the customer
2D, 2.5D and CT inspection for PCB, BGA, semiconductors, connectors and electronic assemblies — from lab to SMT line.
Non-destructive inspectionSee inside without cutting the part
From R&D to productionManual, automated and inline configurations
Nikon + UnicompBreadth of ranges and applications
Specialist NM3D supportSelection, installation, training and after-sales
X-RAY AND CT ECOSYSTEM
Choose the technology visually
Navigate by technology and compare solutions for your application.
X-RAY RANGE FOR ELECTRONICS
From manual analysis to inline inspection
Nikon and Unicomp solutions for solder defects, voids, misaligned components, BGA, chips and reel counting.
Nikon brings premium imaging and advanced CT; Unicomp covers a broad range of offline, inline and X-ray counting systems.
Nikon
XT V 160
Premium 2D and CT inspection for electronics, semiconductors and complex devices.
160 kV2D + CT
Unicomp
AX 7900
Compact system for PCB, BGA, LED and small assembly inspection.
CompactOffline
Unicomp
AX 8200 MAX
High resolution for solder joints, voids, BGA and electronic-component inspection.
High resolutionBGA / SMT
Unicomp
AX 8300 S / Si
High-magnification platform for detailed PCBA and semiconductor inspection.
MicrofocusPCBA
Unicomp
AX 8800 E
Advanced inspection with flexible manipulation for larger samples and assemblies.
FlexibleElectronics
Unicomp
AX 9100 / MAX / VS
Family for high resolution, high magnification and demanding defect inspection.
High magnificationVoids / solder
Unicomp
AX 9500
Inspection for larger boards and assemblies with precise positioning.
Large formatElectronics NDT
Unicomp
CX 3000
Automatic X-ray counting of reel components for logistics and SMT.
X-ray countingSMT
Unicomp
CX 7000 L
Intelligent multi-reel counting for electronics warehousing and production.
AutomatedMultiple reels
Unicomp
LX 2000
Inline X-ray inspection for automated production component control.
Inline100% inspection
Unicomp
LX 9200
High-throughput automated inspection for SMT lines and process control.
High throughputLine integration
Unicomp
AX 8500
110 kV X-ray for leadframes, semiconductors, power electronics and high-precision inspection.
110 kVLeadframe
Unicomp
AX 8300 MAX
Inspection of MOSFET, ceramics, BGA and PCBA with advanced void and crack visualisation.
MOSFETIHDR
FROM IMAGE TO DECISION
Capabilities for high-density electronics
PCB Analysis Suite
Automated BGA, wire-bond, PTH and PoP measurement with pass/fail decisions.
Oblique angle and 360° rotation
Keep the region of interest in view even at high magnification.
High Contrast Filter
Reveal high- and low-contrast detail simultaneously.
Sample protection
Collision avoidance, low dose and ESD options for sensitive devices.
APPLICATION-LED SELECTION
Compare by board size, resolution and throughput
- Part and material
Size, density and geometry - Critical defect
Voids, cracks, soldering or assembly - Resolution and penetration
The right source, power and detector - Throughput and automation
Laboratory, at-line or inline
You do not have to choose alone
Send us the part, the defect you need to detect and the inspection rate. NM3D will recommend the right technology, source, detector and software.
Request a recommendationValidate a sample before deciding
Send us a board or component and the target defect so we can define the most effective configuration.
Request a demo or quote