RX Machines for Electronic Components
High-precision X-ray micro-focus technology facilitates the analysis of defects of electronic components, wafers and printed circuit boards in a fast, non-destructive process.
Nikon XTV130C
Nikon's XT V 130C is a highly flexible and cost-effective X-ray inspection system ideal for electronics and semiconductors. Equipped with a 130 kV/10 W microfocus source and a high-resolution image chain, it offers feature recognition down to 2 μm. The system includes a 4-axis manipulator, with optional rotation, and allows upgrades to automation and computed tomography (CT) technology. The XT V 130C provides an effective solution for real-time inspection and automated analysis.
Nikon XTV160
Nikon's XT V 160 is an advanced X-ray inspection system ideal for production and failure analysis. With a 160 kV/20 W microfocus source and 500 nm feature recognition capability, it delivers high-quality images with up to 2,046x geometric magnification. The system includes a 5-axis manipulator and can be configured for computed tomography (CT). With its optional automation and real-time inspection software, the XT V 160 ensures productivity and accuracy in electronics and semiconductors.
Unicomp AX7900
Widely used for BGA, CSP, Flip Chip, LED, fuses, diodes, PCB, semiconductors, battery industry, small metal foundries, electronic connector modules, cables, photovoltaic industry, among others. This test equipment is essential for non-destructive inspection (NDT) in a variety of applications, ensuring the quality and integrity of the inspected components. The versatility and accuracy of the equipment make it ideal for detecting defects and ensuring compliance with industrial standards.
Unicomp AX8200MAX
Widely used for BGA, CSP, Flip Chip, LED, fuses, diodes, PCB, semiconductors, battery industry, small metal foundries, electronic connector modules, cables, photovoltaic industry, among others. This test equipment is essential for non-destructive inspection (NDT) in a variety of applications, ensuring the quality and integrity of the inspected components. The versatility and accuracy of the equipment make it ideal for detecting defects and ensuring compliance with industrial standards.
Unicomp AX8300S
AX8300S semiconductor microfocus X-ray inspection equipment is a state-of-the-art solution designed to provide high accuracy in detecting internal defects in semiconductor components. With its detailed inspection capability, AX8300S ensures compliance with the strictest quality standards, ensuring the integrity of products. This advanced technology allows for real-time analysis, optimizing efficiency and productivity on production lines, making it indispensable for manufacturers looking to maintain the quality and reliability of their products.
Unicomp AX8300Si
AX8300Si Inline X-ray Inspection Equipment for Semiconductor Lead Structure is an advanced solution designed for the accurate and efficient inspection of semiconductor components. It offers high resolution and internal defect detection capability, ensuring compliance with the required quality standards. With its state-of-the-art technology, the AX8300Si enables detailed, real-time analysis, making it an indispensable tool for manufacturers looking to ensure the integrity and quality of their products, increasing efficiency and productivity on production lines.
Unicomp AX8500
Widely used for BGA, CSP, Flip Chip, LED, fuses, diodes, PCB, semiconductors, battery industry, small metal foundries, electronic connector modules, cables, photovoltaic industry, among others. This test equipment is essential for non-destructive inspection (NDT) in a variety of applications, ensuring the quality and integrity of the inspected components. The versatility and accuracy of the equipment make it ideal for detecting defects and ensuring compliance with industrial standards.
Unicomp AX8800E
The Unicomp Desktop CT AX8800E is a state-of-the-art X-ray inspection equipment that is ideal for a variety of industries, including electronics, semiconductors, lithium batteries, aerospace components, and more. With its high resolution and accuracy, this device allows for the efficient detection of internal defects in electronic components, ensuring quality and compliance with the required standards. Its versatility and efficiency make it an indispensable solution for detailed and fast inspections, helping companies maintain high levels of quality in their products.
Unicomp AX9100
Widely used for BGA, CSP, Flip Chip, LED, fuses, diodes, PCB, semiconductors, battery industry, small metal foundries, electronic connector modules, cables, photovoltaic industry, among others. This test equipment is essential for non-destructive inspection (NDT) in a variety of applications, ensuring the quality and integrity of the inspected components. The versatility and accuracy of the equipment make it ideal for detecting defects and ensuring compliance with industrial standards.
Unicomp AX9100 MAX
Widely used for BGA, CSP, Flip Chip, LED, fuses, diodes, PCB, semiconductors, battery industry, small metal foundries, electronic connector modules, cables, photovoltaic industry, among others. This test equipment is essential for non-destructive inspection (NDT) in a variety of applications, ensuring the quality and integrity of the inspected components. The versatility and accuracy of the equipment make it ideal for detecting defects and ensuring compliance with industrial standards.
Unicomp AX9100 VS
The Unicomp 9100 VS is a high-precision 3D X-ray inspection system, ideal for electronic components, automotive parts, moulded plastics and ceramics. It offers micro-defect detection, multi-mode 3D reconstruction and 7-axis manipulation. Equipped with a maintenance-free X-ray source and high-resolution detector.
Unicomp AX9500
It realizes CT detection in BGA, CSP, flip chips, LEDs and other semiconductors, it can also be used for SMT welding analysis. The 3D CT tomography system (planar CT + cone beam CT) offers advanced technology for these applications.
Unicomp CX3000
Widely applied to electronic components in Tape & Reel, JEDEC Tray and Tube packaging, PCBA, BGA, CSP, Flip Chip, LED, Fuse, Diode, Semiconductor Industry, Batteries, Small Fused Metal Parts, Electronic Connector Modules, Cables, Aerospace Components and Photovoltaic Industry, among others. This wide range of applications highlights the versatility and effectiveness of the equipment, making it an indispensable solution for various industries that require accurate and efficient inspection of their products and components.
Unicomp CX7000L
All X-ray machines manufactured by Unicomp Technology meet the FDA-CDRH CFR 21 1020.40 Subchapter J regulation for cabinet X-ray systems. The FDA-CDRH standard for these systems states that radiation emission should not exceed 5 millirem/h to 2" from any external surface, (leakage <1μSv/h) typically 5-10 times lower than international standards. .
Unicomp LX2000-130KV
Widely used for BGA, CSP, Flip Chip, LED, fuses, diodes, PCB, semiconductors, battery industry, small metal foundries, electronic connector modules, cables, photovoltaic industry, among others. This test equipment is essential for non-destructive inspection (NDT) in a variety of applications, ensuring the quality and integrity of the inspected components. The versatility and accuracy of the equipment make it ideal for detecting defects and ensuring compliance with industrial standards.
Unicomp LX9200
The LX9200 equipment can easily meet the product inspection needs in various directions and different angles of different users. This advanced inspection technology ensures accuracy and reliability, offering a comprehensive solution for manufacturers looking to monitor and evaluate product quality in real-time. Thus, users can benefit from faster and more efficient detection, ensuring compliance with the required quality standards.
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