The growing complexity of electronic components is transforming quality control requirements across the industry. In areas such as EMS, SMT, PCBA, electronics, semiconductors and component assembly, many critical defects are not visible on the surface and can only be analysed using non-destructive inspection technologies.
In this context, NM3D Ibérica highlights the importance of Unicomp Technology’s 110 kV X-ray inspection systems, developed to support manufacturers and quality teams in the fast, accurate and repeatable analysis of electronic components and industrial subassemblies.
This technology makes it possible to inspect solder joints, connections, encapsulated components, circuits, terminals, semiconductors and electronic boards internally, helping to identify defects before they move into later stages of production.
Non-Destructive Inspection For EMS, SMT, PCBA and Semiconductors
In modern electronics manufacturing, components are becoming smaller, denser and more complex. BGAs, QFNs, CSPs, Flip Chips, LEDs, connectors, electronic modules and semiconductors require inspection methods capable of revealing what cannot be assessed by visual inspection alone.
X-ray inspection makes it possible to analyse the inside of an assembly without destroying the product, making it an essential tool for:
- Quality control in SMT lines;
- PCBA inspection;
- Validation of BGA, QFN and CSP solder joints;
- Void analysis in solder joints;
- Flip Chip and semiconductor inspection;
- Wire bonding analysis;
- Connector and terminal control;
- Electronic module inspection;
- Cable and connection analysis;
- Validation of encapsulated components.
For electronics manufacturers, this approach helps reduce rework, accelerate defect detection and increase confidence in the production process.
110 kV for Greater Inspection Capability
Unicomp’s 110 kV X-ray equipment has been developed for applications where it is necessary to combine good penetration, high resolution and image stability.
This capability is particularly important for electronic components with different densities, multilayer structures, encapsulations, hidden solder joints or internal areas that are difficult to access.
With a 110 kV X-ray source, the system can analyse more demanding components than those that can be inspected only with lower-energy systems, while maintaining the ability to obtain detailed images for technical control and defect analysis.
High-angle Oblique Inspection up to 50°
One of the standout features is the ability to perform high-angle oblique inspection up to 50°.
This function is especially relevant when it is necessary to observe defects that may not be evident from a vertical view. By tilting the inspection angle, the operator can analyse solder joints, interfaces, terminals, connections and components with greater visual depth.
This approach helps improve the detection of defects such as:
- Voids in solder joints;
- Poor wetting;
- Misalignment;
- Solder bridges;
- Incomplete connections;
- Terminal defects;
- Defects in BGA and QFN components;
- Issues in encapsulated components.
Oblique inspection provides a more complete view of the part and offers greater confidence when validating critical components.
600 × 520 mm Loading Area
With a 600 × 520 mm loading area, the equipment can accommodate boards, subassemblies and components of relevant size for industrial environments.
This working area provides flexibility for analysing different PCBA formats, electronic modules, connector assemblies, boards with multiple test points and small industrial subassemblies.
For companies working with a wide variety of products, this capability is important because it allows the inspection process to be adapted to different geometries without compromising productivity.
Automated Measurement and One-click Report Generation
Efficiency in quality control depends not only on image quality, but also on how quickly data can be processed and documented.
The system supports one-click generation of inspection reports after automated measurement, allowing analysis results to be quickly transformed into technical documentation.
This feature is especially useful for:
- Quality control records;
- Batch validation;
- Comparison between samples;
- Defect documentation;
- Audit support;
- Communication with customers or suppliers;
- Production traceability.
With automated reports, teams reduce administrative time, minimise manual errors and ensure greater consistency in documentation.
Real-time Results with MAPPING
Another important feature is the real-time display of inspection results through MAPPING.
The system presents inspection status clearly and immediately:
- Red for NG — Not Good;
- Green for OK;
- Yellow for points not yet tested.
This visual display makes it easy to monitor inspection progress intuitively, making the process clearer for operators, quality technicians and production managers.
When there are many inspection points on a board or component, MAPPING helps reduce confusion, improve workflow organisation and speed up decision-making.
iHDR and Pseudo-colour Algorithm
Image quality is a decisive factor in X-ray inspection. Electronic components can include materials with different densities, thicknesses and absorption levels, which makes certain areas more difficult to interpret.
The integration of iHDR and a pseudo-colour algorithm helps improve visual interpretation, highlighting details that may be less evident in a conventional view.
This feature supports the analysis of complex components, improves contrast and facilitates the identification of internal defects.
In practice, it allows the operator to better understand the inspected structure and identify suspicious areas more quickly.
Fast Programming Through File Import
For products with a complex distribution of multiple test points, manual programming can be time-consuming and prone to errors.
The equipment enables fast programming through file import, making it easier to create inspection routines for boards and components with many control points.
This capability is particularly useful in EMS and SMT environments, where companies often work with different references, layout changes, short production runs, multiple products and the need for quick adaptation between projects.
With this feature, teams can reduce preparation time, accelerate new product introduction and improve inspection repeatability.
AI Algorithm Customisation
Industrial inspection is increasingly driven by data and automation. The AI algorithm customisation feature enables the system to adapt quickly to new inspection requirements, new materials or new defect types.
This capability helps reduce algorithm development time and facilitates local adaptation to specific applications.
For companies working with constantly evolving products, new materials, new geometries or new manufacturing processes, this flexibility represents an important advantage.
AI can support defect detection and classification, increasing process consistency and reducing exclusive dependence on manual interpretation.
Practical Applications in the Electronics Industry
110 kV X-ray technology can be applied at different stages of the electronics production cycle.
1. Inspection of BGA, QFN, CSP and Flip Chip Components
These components have solder joints hidden beneath the package, making them impossible to assess through conventional visual inspection.
With X-ray inspection, it is possible to analyse:
- Voids;
- Solder bridges;
- Misalignment;
- Insufficient solder;
- Short circuits;
- Deformed balls;
- Uneven solder distribution;
- Defects in internal connections.
2. PCBA and SMT Analysis
In assembled electronic boards, X-ray inspection makes it possible to verify critical areas without dismantling the board.
It can be applied to the analysis of:
- Hidden solder joints;
- Multilayer components;
- Vias and interconnections;
- Connectors;
- Terminals;
- LEDs;
- SMD components;
- Electronic modules.
3. Semiconductor Inspection
In semiconductors, encapsulations and leadframes, the technology allows internal defects, connections and structures to be observed when they are not externally accessible.
It can support the validation of:
- Wire bonding;
- Encapsulations;
- Leadframes;
- Chips;
- Internal interconnections;
- Cracks;
- Voids;
- Misalignments.
4. Connectors, Cables and Terminals
X-ray inspection is also useful for electrical components and wiring.
It allows the analysis of:
- Crimping;
- Conductor positioning;
- Contact failures;
- Internal cables;
- Overmoulded connectors;
- Metal terminals;
- Internal solder joints;
- Assembly misalignments.
5. Defect Analysis and Failure Investigation
When a failure occurs in production or in the field, X-ray inspection makes it possible to investigate the component without destroying the sample.
This is essential to understand whether the problem is related to soldering, assembly, material, geometry, thermal process, contamination or an internal defect.
NM3D Ibérica: X-ray Inspection for Faster and Safer Decisions
At NM3D Ibérica, we support industrial companies in the implementation of advanced inspection, metrology and quality control technologies.
Unicomp Technology’s 110 kV X-ray inspection represents an effective solution for companies working with EMS, SMT, PCBA, electronics, semiconductors, connectors, cables and critical components.
With oblique inspection up to 50°, a 600 × 520 mm loading area, automated reports, real-time MAPPING, iHDR, pseudo-colour, file-import programming and AI algorithm customisation, this technology helps transform quality control into a faster, more traceable and more intelligent process.
More than detecting defects, it makes it possible to understand the process, improve production and make technical decisions with greater confidence.