VMF-K
VMZ-S
iNEXIV VMA
VMZ-H3030
VMZ-NWL200
Software NEXIV
Higher throughput
Up to 1.5× throughput in applications such as probe cards.
2D AND 3D OPTICAL MEASUREMENT
NEXIV VMF-K Series
Non-contact 3D geometry with confocal speed and detail
Simultaneous 2D imaging and height measurement for semiconductors, probe cards, bonding wires, thin films and precision-engineered components.
2D + 3DSimultaneous measurement
0,01 μmMinimum readout
3 modelosUp to 650 × 610 mm
ConfocalComplex surfaces
NIKON NEXIV ECOSYSTEM
Choose the technology visually
Navigate across all video measuring solutions without losing the context of the range.
PRODUCT HIGHLIGHTS
See what changes in measurement
Features that connect the technology to metrology results and productivity.
2D and height in one field
Capture coordinates and topography without repositioning the part.
Difficult materials
Measures high-contrast surfaces, transparent materials and thin films.
CONFIGURATIONS
Match the system to the part size
| Model / function | Envelope / capability | Load / application |
|---|---|---|
| VMF-K3040 | 300 × 400 × 150 mm | 20 kg |
| VMF-K6555 | 650 × 550 × 150 mm | 30 kg |
| VMF-K6561 | 650 × 610 × 150 mm | 30 kg |
APPLICATIONS
Where it creates value
Probe cards and bonding wires
Wafer-level packaging
PLP panels up to 600 × 600 mm
Thin films and resists
Substrates and microcomponents
NM3D TECHNICAL SELECTION
The right configuration starts with the part
Send the size, tolerance, material and throughput. We recommend the right optics, envelope, software and automation.
