Consistent results
Automation reduces operator-to-operator variability.
AUTOMATIC WAFER INSPECTION
NEXIV VMZ-NWL200
From carrier to result in one click
Integrates NEXIV metrology with the NWL200 wafer loader for automatic measurement of 6- and 8-inch wafers, with traceability and fast process feedback.
6″ e 8″Wafers in carrier
1 cliqueAutomatic operation
3×Productivity
Quality 4.0Data and traceability
PRODUCT HIGHLIGHTS
See what changes in measurement
Features that connect the technology to metrology results and productivity.
Efficient workflow
Integrated transfer, measurement and data feedback.
Visual operation
Select chips directly on the graphical wafer map.
CONFIGURATIONS
Match the system to the part size
| Model / function | Envelope / capability | Load / application |
|---|---|---|
| NEXIV | VMZ-S3020 | Type 2 / 3 / TZ |
| Wafer loader | NWL200 | 6″ e 8″ |
| Célula | 4125 × 3040 mm | Automática |
APPLICATIONS
Where it creates value
Wafer-level packaging
Bumps and redistribution
Masks and MEMS
Process control
Production traceability
NM3D TECHNICAL SELECTION
The right configuration starts with the part
Send the size, tolerance, material and throughput. We recommend the right optics, envelope, software and automation.
