110 kV X-ray inspection for electronics: precision, automation and real-time control

In modern electronics production, components are increasingly small, dense and complex. BGAs, QFNs, CSPs, Flip Chips, LEDs, connectors, electronic modules and semiconductors require inspection methods capable of revealing what cannot be assessed by visual inspection alone. X-ray inspection enables analysis of the assembly interior without destroying the product, becoming an essential tool for quality control in SMT lines, PCBA inspection, BGA, QFN and CSP solder validation, void analysis in solder, Flip Chip and semiconductor inspection, wire bonding analysis, connector and terminal control, electronic module inspection, cable and connection analysis, and encapsulated component validation. For electronics manufacturers, this approach enables reduced rework, accelerated defect detection and increased confidence in the production process.

Unicomp's 110 kV X-ray equipment was developed to address applications requiring a combination of good penetration, high resolution and image stability. This capability is particularly important in electronic components with different densities, multilayers, encapsulations, hidden solder joints or hard-to-access internal areas. With a 110 kV X-ray source, the system enables analysis of more demanding components while maintaining the ability to obtain detailed images for technical control and defect analysis. One standout feature is the high-angle oblique inspection capability up to 50°, especially relevant when observing defects that may not be evident in a vertical view. By tilting the inspection angle, the operator can analyze solder joints, interfaces, terminals, connections and components with greater visual depth, improving detection of voids in solder joints, lack of wetting, misalignment, solder bridges, incomplete connections, terminal failures, BGA and QFN defects, and problems in encapsulated components. With a loading area of 600 × 520 mm, the equipment accommodates boards, subassemblies and components of relevant dimensions for industrial environments, offering flexibility to analyze different PCBA formats, electronic modules, connector assemblies, boards with multiple test points and small industrial subassemblies. The system supports one-click inspection report generation after automated measurement, enabling rapid transformation of analysis results into technical documentation for quality control recording, batch validation, sample comparison, defect documentation, audit support, communication with customers or suppliers, and production traceability. Real-time visualization of results through MAPPING presents inspection status clearly and immediately: red for NG (Not Good), green for OK, and yellow for points not yet tested. Integration of iHDR and pseudo-color algorithm enables improved visual interpretation of the image, highlighting details that might be less evident in conventional visualization. The equipment enables rapid programming through file import, facilitating creation of inspection routines for boards and components with many control points. The artificial intelligence algorithm customization functionality enables rapid system adaptation to new inspection requirements, new materials or new defect types, supporting defect detection and classification, increasing process consistency and reducing exclusive dependence on manual interpretation.

110 kV X-ray technology can be applied at different stages of the electronics production cycle. In BGA, QFN, CSP and Flip Chip inspection, components with solder joints hidden under encapsulation, it is possible to analyze voids, solder bridges, misalignment, lack of solder, short circuits, deformed spheres, irregular solder distribution and defects in internal connections. In PCBA and SMT analysis, X-ray inspection enables verification of critical areas without disassembling the board, applying to analysis of hidden solder joints, multilayer components, vias and interconnections, connectors, terminals, LEDs, SMD components and electronic modules. In semiconductor, encapsulation and leadframe inspection, the technology enables observation of internal defects, connections and structures that are not externally accessible, supporting validation of wire bonding, encapsulations, leadframes, chips, internal interconnections, cracks, voids and misalignments. For connectors, cables and terminals, it enables analysis of crimping, conductor position, contact failures, internal cables, overmolded connectors, metal terminals, internal solder joints and assembly misalignments. In defect analysis and failure investigation, X-ray inspection enables component investigation without destroying the sample, essential for understanding whether the problem is related to soldering, assembly, material, geometry, thermal process, contamination or internal defect.

With oblique inspection up to 50°, loading area of 600 × 520 mm, automated reports, real-time MAPPING, iHDR, pseudo-color, programming by file import and AI algorithm customization, this technology helps transform quality control into a faster, traceable and more intelligent process. Teams reduce administrative time, minimize manual errors and ensure greater documentation consistency. MAPPING helps reduce confusion, improve work organization and accelerate decision-making. Rapid programming enables reduced setup time, accelerated new product introduction and improved inspection repeatability. More than detecting defects, it enables process understanding, production improvement and technical decisions with greater confidence.

At NM3D Ibérica, we support industrial companies in implementing advanced inspection, metrology and quality control technologies. Unicomp Technology's 110 kV X-ray inspection represents an effective solution for companies working with EMS, SMT, PCBA, electronics, semiconductors, connectors, cables and critical components.